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AMKR - Amkor Technology

$22.19  -0.21 (-0.94%)

Updated: 15:07 Oct 15, 2021 EST

$22.53  0.13 (0.58%)

Premarket

Last Day's Trend

Equity Rank Position

Overall Rank Position

AI Forecast 30-days Price Trend

N/A

Now

39.41

This Week

35.81

This Qtr.

27.35

Next Qtr.

33.25

This Year

42.17

Amkor Technology's Position Within the Semiconductors Industry

CURRENT VOLATILITY

Curr. Week Curr. Month Curr. Quarter Next Quarter Curr Year
-4.26 -1.62 -0.11 -0.11 0.21

CURRENT VOLATILITY RANK

Variation from the lowest to the highest value in a period.

Curr. Week Curr. Month Curr. Quarter Next Quarter Curr Year
4.26 2.77 2.16 2 2.43

STOCHASTIC METRIC

The STOCHASTIC METRIC shows when a financial asset has moved into an overbought or oversold position.

OVERSOLD
OVERBOUGHT
Curr. Week Next Week Curr. Month Curr. Quarter
3.91% 3.26% 2.21% 13.58%

MOVING AVERAGE METRIC

5 Sessions Change 5 Sessions 20 Sessions Change 20 Sessions 50 Sessions Change 50 Sessions 200 Sessions
23.05 -6.76% 24.72 -6.61% 26.47 10.71% 23.91

RSI METRIC

RS Hour RSI Hour RS Day RSI Day
0.86 71.43 0.2 46.24
0 (Bottom)
100 (Top) Data Normalization
Rank (0-100)
0 (Bottom)
100 (Top) Data Normalization
Rank (0-100)

AMKOR TECHNOLOGY - HISTORICAL DATA 6M

  • Last price

    $ 22.19

  • Daily change

    $ -0.21

  • Previous Close

    $ 22.4

  • Last Updated

    15:07 Oct 15, 2021 EST

Amkor Technology

2045 East Innovation Circle
Tempe, AZ 85284
United States
480 821 5000
http://www.amkor.com

Sectors: Technology
Industry: Semiconductors
F. Time Employees: 29
Description

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States and internationally. The company offers turnkey packaging and test services, including semiconductor wafer bumps, wafer probes, wafer back-grinds, package design, packaging, and test and drop shipment services. Its packages employ wirebond, flip chip, copper clip, and other interconnect technologies. The company also provides semiconductor testing services, such as wafer and final test services; flip chip scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory, and as applications processors in mobile devices; and flip chip ball grid array products for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages used in power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electro-mechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Corporate Governance

Amkor Technology, Inc.’s ISS Governance QualityScore as of December 9, 2019 is 4. The pillar scores are Audit: 1; Board: 4; Shareholder Rights: 4; Compensation: 7.

AMKOR TECHNOLOGY'S HOLDERS RANK

List of holders with stock participation in Amkor Technology.